AM183031WM-BM-R 1.6–3.3GHz GaAs MMIC Power Amplifier Price & Stock
The AM183031WM-BM-R from AMCOM Communications is a broadband GaAs MMIC power amplifier covering the nominal 1.6–3.3GHz frequency range. It provides high gain and approximately one watt of compressed output power, making it suitable for wireless infrastructure, broadband RF modules and medium-power driver stages.
The device is supplied in a ceramic surface-mount package with RF and DC leads positioned for direct PCB assembly. Its input and output are internally matched to 50 ohms, reducing the amount of external RF matching required during module design.
Technical Specifications
| Parameter | AM183031WM-BM-R |
| Manufacturer | AMCOM Communications |
| Device Type | GaAs MMIC Power Amplifier |
| Nominal Frequency Range | 1.6–3.3GHz |
| Typical Performance Range | 1.7–3.5GHz |
| Small-Signal Gain | 30.5dB typical |
| Minimum Gain | 27dB |
| Gain Ripple | ±1.0dB typical |
| Output P1dB | 30.5dBm typical |
| Output P3dB | 31.5dBm typical |
| Third-Order Intercept, IP3 | 40dBm typical |
| Noise Figure | Less than 7.5dB typical |
| Input Return Loss | 18dB typical |
| Output Return Loss | 12dB typical |
| Efficiency at P1dB | 20% typical |
| RF Impedance | 50Ω |
| Drain Voltage | 8V |
| Quiescent Drain Current | 750mA |
| Typical Gate Voltage | Approximately −0.6V |
| Thermal Resistance | 11.7°C/W |
| Package | 10-lead ceramic SMT |
| Compliance | RoHS |
Main Advantages
The AM183031WM-BM-R offers a practical combination of broadband coverage, high gain and medium RF output power. Its 50-ohm matched architecture simplifies RF integration, while the ceramic SMT package supports compact amplifier and transmitter module designs.
Typical uses include:
Wireless internet access equipment
Wireless local-loop systems
MMDS communication equipment
Broadband RF driver stages
Laboratory RF amplification
Communication and telemetry transmitters
These applications are consistent with those identified in AMCOM’s product documentation.
Thermal and PCB Design Considerations
Proper heat dissipation is important when integrating the AM183031WM-BM-R. AMCOM recommends mounting the device directly to an effective metal heat sink because of its relatively high DC power dissipation.
For PCB mounting, the manufacturer recommends using a thin circuit board with solder- or metal-filled thermal vias beneath the package. The negative gate voltages should be established before the drain voltages are applied, helping prevent damage to the amplifier stages.
Package Variants
| Model | Package Configuration | Suitable Use |
| AM183031WM-BM-R | Ceramic surface-mount package | Compact PCB and SMT assemblies |
| AM183031WM-EM-R | Drop-in package with straight leads | Hybrid and drop-in RF modules |
| AM183031WM-FM-R | BM device mounted on a gold-plated copper flange | Designs requiring easier heat-sink mounting |
Frequently Asked Questions
What frequency range does the AM183031WM-BM-R cover?
The nominal product frequency range is 1.6–3.3GHz. The Rev. 5 datasheet also lists typical broadband performance from approximately 1.7 to 3.5GHz.
How much RF output power does it provide?
The amplifier delivers a typical P1dB output power of 30.5dBm, equivalent to slightly more than 1W. Typical output power at 3dB compression is 31.5dBm.
Does the AM183031WM-BM-R require external impedance matching?
The RF input and output are internally matched to 50 ohms, although normal DC-bias decoupling and PCB transmission-line design are still required.
What is the difference between BM-R and FM-R?
The BM-R is the ceramic SMT version. The FM-R uses the BM-R amplifier mounted on a gold-plated copper flange carrier, making attachment to a metal heat sink easier.
Is a heat sink required?
A low-resistance thermal path is strongly recommended. The device dissipates significant DC power, so inadequate thermal management can increase junction temperature and reduce reliability.
