SAMSUNG
SAMSUNG
The advancement of supercomputing and AI-based technologies require the highest caliber of memory that can meet industry needs for bandwidth, capacity, and efficiency. HBM2E Flashbolt can boost the power of AI, handle more Big Data through its expanded capacity, and provide high-bandwidth.
HBM2
HBM3
DataStorageIC offer HBM lead time 4-6weeks .
HBM3
| Part Number | Density | Package | Speed | Refresh | Organization |
 KHBA84A03D-MC1H | 16 GB | MPGA | 6.4 Gbps | 32 ms | 1024 |
| KHBA84A03C-MC1H | 16 GB | MPGA | 6.4 Gbps | 32 ms | 1024 |
| KHBAC4A03D-MC1H | 24 GB | MPGA | 6.4 Gbps | 32 ms | 1024 |
| KHBAC4A03C-MC1H | 24 GB | MPGA | 6.4 Gbps | 32 ms | 1024 |
HBM3E
| Part Number | Density | Package | Speed | Refresh | Organization |
| KHBBC4B03C-MC1K | 36 GB | MPGA | 9.2 Gbps | 32 ms | 1024 |
| KHBA84A03D-MC1H | 16 GB | MPGA | 6.4 Gbps | 32 ms | 1024 |
| KHBAC4A03D-MC1H | 24 GB | MPGA | 6.4 Gbps | 32 ms | 1024 |
| KHBB84A03B-MC1J | 24 GB | MPGA | 8.6 Gbps | 32 ms | 1024 |
| KHBA84A03C-MC1H | 16 GB | MPGA | 6.4 Gbps | 32 ms | 1024 |
| KHBAC4A03C-MC1H | 24 GB | MPGA | 6.4 Gbps | 32 ms | 1024 |
