Vincotech flow E3BP Power Modules | 1200V SiC & MNPC Modules
Brand：Vincotech
Housing Family：flow E3BP
Package Type：Base-plated power module housing
Footprint：109.6 mm × 59.7 mm
Mechanical Connection：4 towers
Mounting Height Options：12 mm / 15 mm package versions
Baseplate：Copper baseplate
Baseplate Shape：Convex-shaped baseplate
Housing Material：CTI600
Electrical Interconnection：Press-fit pin or solder pin
Typical Applications：Solar inverter, ESS, industrial drives, EV charging, power conversion
Related Technologies：IGBT7 H7, SiC MOSFET, NPC, MNPC, Half-Bridge
The Vincotech flow E3BP is a base-plated power module housing designed for high-power power electronics systems that require strong thermal performance, high power density and reliable PCB integration. With a compact footprint of 109.6 mm × 59.7 mm, the flow E3BP housing is suitable for next-generation power conversion designs where thermal contact, mechanical stability and efficient module assembly are important.
This housing platform is used in Vincotech power modules for renewable energy, solar inverters, energy storage systems, industrial drives, motion control, EV charging equipment and high-power power supply applications. It supports both press-fit and solder pin interconnection options, depending on the selected module part number.
Vincotech flow E3BP Part Numbers
| Part Number | Topology / Features | Voltage / Current Rating | Chip Technology | Interconnection | Height |
| 30-EP12NIA600H701-PM00F87T | Three-level NPC I-Type, low-side Kelvin, split topology, temp sensor | 1200 V / 600 A | IGBT7 H7 | Press-fit pin | 12 mm |
| 30-EP12NIA600H702-PM00F85T | Three-level NPC I-Type, low-side Kelvin, split topology, temp sensor | 1200 V / 600 A | IGBT7 H7 | Press-fit pin | 12 mm |
| 30-EP12NIA600H703-PM00F83T | Three-level NPC I-Type, low-side Kelvin, split topology, temp sensor | 1200 V / 600 A | IGBT7 H7 | Press-fit pin | 12 mm |
| 30-E312NIA600H702-PM00F85Z | Three-level NPC I-Type, low-side Kelvin, split topology, temp sensor | 1200 V / 600 A | IGBT7 H7 | Solder pin | 12 mm |
| 30-EP12NIA400H7-PM40F07T | Three-level NPC I-Type, Kelvin emitter, temp sensor | 1200 V / 400 A | IGBT7 H7 | Press-fit pin | 12 mm |
| 30-E312NIA400H702-PM40F27Z | Three-level NPC I-Type, Kelvin emitter, temp sensor | 1200 V / 400 A | IGBT7 H7 | Solder pin | 12 mm |
| 30-EP12NIB400H710-PR49F07T | Three-level NPC I-Type, low-side Kelvin, split topology, temp sensor | 1200 V / 400 A | IGBT7 H7 | Press-fit pin | 12 mm |
| 30-E312NIB400H710-PR49F07Z | Three-level NPC I-Type, low-side Kelvin, split topology, temp sensor | 1200 V / 400 A | IGBT7 H7 | Solder pin | 12 mm |
| 30-E312NIB560H710-PR40F07Z | Three-level NPC I-Type, low-side Kelvin, split topology, temp sensor | 1200 V / 560 A | IGBT7 H7 | Solder pin | 12 mm |
| 30-E312NIB560H701-PS70F57Z | Three-level NPC I-Type, Kelvin emitter, temp sensor | 1200 V / 560 A | IGBT7 H7 | Solder pin | 12 mm |
| 30-EP12NIC560H7-PU10F57T | Three-level NPC I-Type, low-side Kelvin, split topology, temp sensor | 1200 V / 560 A | IGBT7 H7 | Press-fit pin | 12 mm |
| 30-E312NIC560H7-PU10F57Z | Three-level NPC I-Type, low-side Kelvin, split topology, temp sensor | 1200 V / 560 A | IGBT7 H7 | Solder pin | 12 mm |
| 30-EP12NMA300H7-PM18F07T | Three-level MNPC T-Type, Kelvin emitter, temp sensor | 1200 V / 300 A | IGBT7 H7 | Press-fit pin | 12 mm |
| 30-E312NMA300H7-PM18F07Z | Three-level MNPC T-Type, Kelvin emitter, temp sensor | 1200 V / 300 A | IGBT7 H7 | Solder pin | 12 mm |
| 30-EP12NMA400H7-PM19F07T | Three-level MNPC T-Type, Kelvin emitter, temp sensor | 1200 V / 400 A | IGBT7 H7 | Press-fit pin | 12 mm |
| 30-E312NMA400H7-PM19F07Z | Three-level MNPC T-Type, Kelvin emitter, temp sensor | 1200 V / 400 A | IGBT7 H7 | Solder pin | 12 mm |
| 30-EQ12NAA003MS04-PT18F76T | Three-level ANPC, Kelvin emitter, temp sensor, gate resistor | 1200 V / 250 A | SiC MOSFET | Press-fit pin | 15 mm |
| 30-E312NAA003MS13-PS48F75Z | Three-level ANPC, Kelvin emitter, temp sensor, gate resistor | 1200 V / 3 m | SiC MOSFET | Solder pin | 12 mm |
| 30-EP12SAA001MS-PT59F77T | Half-Bridge, common emitter point, temp sensor | 1200 V / 1020 A | SiC MOSFET | Press-fit pin | 12 mm |
| 30-EP232PB004ME01-PR09F07T | Half-Bridge, temp sensor | 2300 V / 400 A | SiC MOSFET | Press-fit pin | 12 mm |
Application Areas
The Vincotech flow E3BP housing is suitable for high-power systems where efficiency, thermal performance and compact design are required. Common application areas include:
Utility-scale PV inverters
Commercial solar inverters
Energy storage systems and PCS
Industrial drives and motor control
EV charging stations
UPS and high-power power supplies
Motion control and power conversion equipment
Why Choose Vincotech flow E3BP?
Vincotech flow E3BP modules are designed for demanding power electronics systems that need higher power density and improved thermal handling. The copper baseplate and convex baseplate design help improve thermal contact with the heatsink, while CTI600 housing material supports demanding insulation requirements in high-voltage systems.
For engineers and buyers, the flow E3BP platform offers a practical solution for selecting high-power IGBT or SiC power modules in a standardized package. It also supports different electrical interconnection methods, making it suitable for both solder-based and press-fit PCB assembly processes.
Inquiry Information
We can support Vincotech flow E3BP power module sourcing, datasheet checking and model selection. Please send the required part number, quantity and application requirements, and our team will help confirm availability, lead time and suitable alternatives.
