The UMS CHA6357-98F, CHA6357-QKB and CHA7362-QWA are GaN-on-SiC high-power amplifiers for Ka-Band transmit systems.

The CHA6357-98F is a bare-die solution offering high gain and medium output power. The CHA6357-QKB provides similar frequency coverage in a compact surface-mount package, while the CHA7362-QWA targets systems requiring greater RF output from a packaged amplifier.

All three models are intended for VSAT, satellite communication, 5G infrastructure and Ka-Band radio applications.

Specification Comparison

Which Ka-Band Amplifier Should You Choose?

Choose CHA6357-98F for Custom Bare-Die Modules

The CHA6357-98F is the preferred option when the amplifier will be integrated into a hybrid microwave module, multichip assembly or custom transmit front end.

Its bare-die format gives the designer greater control over RF transitions, thermal attachment and module dimensions. It also offers the highest gain of the three models and includes an output-power detector.

Choose CHA6357-QKB for Compact Surface-Mount Designs

The CHA6357-QKB is better suited to PCB-based systems that require a small, standard surface-mount package.

Its compact QFN format simplifies assembly compared with bare-die bonding and is useful in dense phased arrays, compact VSAT terminals and multichannel transmit systems. Its lower quiescent current can also benefit designs with limited standby power or thermal capacity.

Choose CHA7362-QWA for Higher Per-Channel Output

The CHA7362-QWA is intended for systems where maximum RF output and link margin are more important than minimum package size or current consumption.

It can reduce the number of amplifier channels or combining stages required to reach a specified transmitter output. The larger QFN package also provides more area for power and thermal connections than the smaller CHA6357-QKB package.

Typical Applications

Ka-Band VSAT terminals

Satellite communication uplinks

5G millimeter-wave infrastructure

Active phased-array transmitters

Point-to-point radio links

Ka-Band solid-state power amplifiers

RF test and measurement systems

For high-channel-count arrays, the choice generally depends on the balance between channel density, thermal load and output power per antenna element.

Price and RFQ

Pricing and lead time vary by model, package format and order quantity.

For an RFQ, specify the complete part number, required quantity, target delivery date and any lot, date-code or traceability requirements.

Frequently Asked Questions

1. Are CHA6357-98F and CHA6357-QKB the same product in different formats?

They cover the same frequency range and belong to the same amplifier family, but they have different gain, output power, bias and assembly requirements. They should be evaluated as separate products rather than assumed to be identical die and packaged versions.

2. Which model provides the highest RF output?

The CHA7362-QWA provides the highest saturated output and is the preferred choice when greater per-channel transmit power is required.

3. Which model is easiest to integrate on a conventional PCB?

The CHA6357-QKB is generally the easiest to integrate because it uses a compact 4 × 4mm surface-mount QFN package. The CHA7362-QWA is also surface mount but uses a larger package.

4. Can the CHA6357-98F or CHA6357-QKB be used as a driver amplifier?

Yes. UMS states that both models provide useful linearity and reduced consumption under output back-off, allowing them to operate as driver stages in suitable power-amplifier chains.

5. Are CHA6357-QKB and CHA7362-QWA drop-in replacements?

No. They use different package sizes, pin arrangements, drain voltages and current levels. The PCB layout, bias circuit and thermal design must be reviewed when changing between the two models.