The Qorvo QPA2211, QPA2212 and QPA2212D are GaN-on-SiC power amplifiers covering 27.5–31GHz. They are designed for Ka-band satellite communications, 5G infrastructure and other high-power millimeter-wave transmitters.

The QPA2211 and QPA2212 are supplied in bolt-down packages for easier system integration, while the QPA2212D is a bare MMIC die intended for custom microwave modules.

QPA2211, QPA2212 and QPA2212D Comparison

Which Ka-Band Amplifier Should You Choose?

QPA2211: Lower-Power Packaged Solution

The QPA2211 is suitable for transmitters requiring approximately 5W linear output and more than 10W saturated output.

Its bolt-down CP package has a pure copper base, providing a direct thermal path to the chassis or heat spreader. It also has the lowest quiescent current of the three models.

Choose the QPA2211 for:

Lower-power Ka-band SATCOM uplinks

Systems with limited power and cooling capacity

Packaged designs requiring easier mechanical integration

5G millimeter-wave transmitter stages

QPA2212: Higher-Power Packaged Amplifier

The QPA2212 increases rated output power to approximately 20W while retaining a 15.2 × 15.2mm bolt-down package.

It is the most practical choice when higher RF power is required but the design still needs a packaged device rather than bare-die assembly. Its RF ports are matched to 50Ω and include integrated DC-blocking capacitors.

Choose the QPA2212 for:

Higher-power SATCOM ground terminals

Ka-band uplink transmitters

5G millimeter-wave infrastructure

Systems requiring approximately 10W linear output

Designs using conventional packaged-component assembly

QPA2212D: Highest Power for Custom Modules

The QPA2212D provides the highest rated output in the group at up to 25W. Its bare-die format minimizes size and allows direct integration into custom microwave modules.

However, the die requires wire bonding, suitable die attachment, controlled RF transitions and a carefully designed thermal path. It is therefore more appropriate for experienced microwave-module manufacturers than standard PCB assembly.

Choose the QPA2212D for:

Custom Ka-band microwave modules

Applications requiring the highest available output power

Hybrid assemblies and multichip modules

Designs with in-house die-attach and wire-bond capability

Systems where package size must be minimized

Frequently Asked Questions

Which model provides the highest output power?

The QPA2212D provides the highest rated output at up to 25W. The QPA2212 is rated at approximately 20W, while the QPA2211 provides more than 10W.

When should QPA2212 be selected instead of QPA2211?

Choose the QPA2212 when the transmitter requires higher linear and saturated output power and can support the increased current consumption and thermal load.

Is QPA2212D a direct replacement for QPA2212?

No. The QPA2212 is a bolt-down packaged component, while the QPA2212D is a bare MMIC die. Their assembly, RF interface and thermal-integration requirements are different.

Which device is easier to integrate?

The QPA2211 and QPA2212 are easier to integrate because they are supplied in bolt-down packages. The QPA2212D requires die attachment and wire bonding.

Do all three amplifiers cover the same frequency range?

Yes. All three models operate from 27.5 to 31GHz and target Ka-band SATCOM and 5G infrastructure applications.

Conclusion

Select the QPA2211 for lower-power packaged systems, the QPA2212 for higher-power transmitters requiring a bolt-down component, and the QPA2212D for custom modules requiring the highest output power and bare-die integration.

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