QPA2811 vs QPA1011D | X-Band GaN Power Amplifier Comparison
QPA2811 vs QPA1011D: Which X-Band GaN Power Amplifier Should You Choose?
The Qorvo QPA2811 and QPA1011D are both X-band GaN-on-SiC power amplifiers, but they target different design requirements.
The biggest differences are output power, frequency coverage, gain, efficiency, and package type.
If your application requires higher RF output power and a packaged device, QPA2811 is usually the stronger candidate. If wider X-band coverage and bare-die integration are more important, QPA1011D may be more suitable.

QPA2811 vs QPA1011D Quick Comparison
| Parameter | QPA2811 | QPA1011D |
|---|---|---|
| Frequency Range | 8.5–10.55 GHz | 7.9–11 GHz |
| Saturated Output Power | 48.9 dBm, about 60–78 W | About 25 W |
| Large-Signal Gain | 27.9 dB | About 20 dB |
| Power-Added Efficiency | 48.5% | About 37% |
| Supply Voltage | 24 V | 24 V |
| RF Impedance | 50 Ω | 50 Ω |
| Package | 7 × 7 mm QFN overmold | Bare Die |
| Main Applications | High-power military radar | Radar, Satcom, data links |
Qorvo specifies the QPA2811 for 8.5–10.55 GHz operation with 48.9 dBm saturated output power, 27.9 dB large-signal gain and 48.5% PAE.
The QPA1011D operates from 7.9–11 GHz and typically provides about 25 W saturated output power, 20 dB large-signal gain and approximately 37% PAE.
When Should You Choose QPA2811?
Choose QPA2811 when higher output power is the main requirement.
Its key advantages include:
Approximately 60 W class X-band output
27.9 dB large-signal gain
48.5% power-added efficiency
7 × 7 mm packaged QFN design
50 Ω matched RF ports
Good fit for high-power radar transmit chains
QPA2811 is especially attractive when the design needs a compact packaged PA without using bare-die assembly. Qorvo specifically positions it for military radar applications.
When Should You Choose QPA1011D?
Choose QPA1011D when wider frequency coverage and bare-die integration are more important.
Its advantages include:
Wider 7.9–11 GHz operating range
About 25 W saturated output power
Approximately 20 dB large-signal gain
50 Ω matched RF ports
Integrated DC blocking capacitors
Suitable for radar, satellite communications, and data links
Because QPA1011D is supplied as a die, it is better suited to hybrid modules, multi-chip modules, and other applications where engineers want direct control over RF layout and packaging.
QPA2811 vs QPA1011D: Which Has More Output Power?
QPA2811 provides significantly higher output power.
QPA2811 delivers 48.9 dBm saturated output power, while QPA1011D is typically rated around 25 W.
For radar systems requiring higher transmit power from a single MMIC, QPA2811 is therefore the more natural device to evaluate.
Which Has Wider Frequency Coverage?
QPA1011D has the wider operating bandwidth.
QPA2811: 8.5–10.55 GHz
QPA1011D: 7.9–11 GHz
QPA1011D may therefore be more suitable for designs that need coverage closer to the lower and upper edges of the X-band.
Which Is Easier to Integrate?
For a standard PCB-based design, QPA2811 is generally easier to integrate because it comes in a 7 × 7 mm packaged format.
QPA1011D is a bare-die MMIC and normally requires:
Die attach
Wire bonding
Thermal management
Controlled RF interconnect design
This gives engineers more packaging flexibility, but also increases assembly complexity.
Which X-Band PA Should You Choose?
Choose QPA2811 if you need:
Higher RF output power
Higher large-signal gain
Higher efficiency
Packaged QFN integration
High-power radar operation
Choose QPA1011D if you need:
Wider 7.9–11 GHz frequency coverage
Bare-die integration
Around 25 W RF output
Radar, Satcom, or data-link applications
The two devices are not direct replacements for each other. Their package formats, output power levels, gain, and operating bandwidth are significantly different.
QPA2811 vs QPA1011D Summary
For high-power X-band radar, QPA2811 offers the stronger combination of output power, gain, and efficiency.
For wider-band X-band systems or bare-die module integration, QPA1011D offers more frequency coverage and packaging flexibility.
Before selecting either device, engineers should confirm the required operating frequency, RF output power, thermal design, package format, and bias requirements.



